WSL2-Linux-Kernel/drivers/thermal/Kconfig

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# Generic thermal sysfs drivers configuration
#
menuconfig THERMAL
tristate "Generic Thermal sysfs driver"
help
Generic Thermal Sysfs driver offers a generic mechanism for
thermal management. Usually it's made up of one or more thermal
zone and cooling device.
Each thermal zone contains its own temperature, trip points,
cooling devices.
All platforms with ACPI thermal support can use this driver.
If you want this support, you should say Y or M here.
if THERMAL
config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
int "Emergency poweroff delay in milli-seconds"
depends on THERMAL
default 0
help
Thermal subsystem will issue a graceful shutdown when
critical temperatures are reached using orderly_poweroff(). In
case of failure of an orderly_poweroff(), the thermal emergency
poweroff kicks in after a delay has elapsed and shuts down the system.
This config is number of milliseconds to delay before emergency
poweroff kicks in. Similarly to the critical trip point,
the delay should be carefully profiled so as to give adequate
time for orderly_poweroff() to finish on regular execution.
If set to 0 emergency poweroff will not be supported.
In doubt, leave as 0.
config THERMAL_HWMON
bool
prompt "Expose thermal sensors as hwmon device"
depends on HWMON=y || HWMON=THERMAL
default y
help
In case a sensor is registered with the thermal
framework, this option will also register it
as a hwmon. The sensor will then have the common
hwmon sysfs interface.
Say 'Y' here if you want all thermal sensors to
have hwmon sysfs interface too.
config THERMAL_OF
bool
prompt "APIs to parse thermal data out of device tree"
depends on OF
default y
help
This options provides helpers to add the support to
read and parse thermal data definitions out of the
device tree blob.
Say 'Y' here if you need to build thermal infrastructure
based on device tree.
config THERMAL_WRITABLE_TRIPS
bool "Enable writable trip points"
help
This option allows the system integrator to choose whether
trip temperatures can be changed from userspace. The
writable trips need to be specified when setting up the
thermal zone but the choice here takes precedence.
Say 'Y' here if you would like to allow userspace tools to
change trip temperatures.
choice
prompt "Default Thermal governor"
default THERMAL_DEFAULT_GOV_STEP_WISE
help
This option sets which thermal governor shall be loaded at
startup. If in doubt, select 'step_wise'.
config THERMAL_DEFAULT_GOV_STEP_WISE
bool "step_wise"
select THERMAL_GOV_STEP_WISE
help
Use the step_wise governor as default. This throttles the
devices one step at a time.
config THERMAL_DEFAULT_GOV_FAIR_SHARE
bool "fair_share"
select THERMAL_GOV_FAIR_SHARE
help
Use the fair_share governor as default. This throttles the
devices based on their 'contribution' to a zone. The
contribution should be provided through platform data.
config THERMAL_DEFAULT_GOV_USER_SPACE
bool "user_space"
select THERMAL_GOV_USER_SPACE
help
Select this if you want to let the user space manage the
platform thermals.
config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
bool "power_allocator"
select THERMAL_GOV_POWER_ALLOCATOR
help
Select this if you want to control temperature based on
system and device power allocation. This governor can only
operate on cooling devices that implement the power API.
endchoice
config THERMAL_GOV_FAIR_SHARE
bool "Fair-share thermal governor"
help
Enable this to manage platform thermals using fair-share governor.
config THERMAL_GOV_STEP_WISE
bool "Step_wise thermal governor"
help
Enable this to manage platform thermals using a simple linear
governor.
config THERMAL_GOV_BANG_BANG
bool "Bang Bang thermal governor"
default n
help
Enable this to manage platform thermals using bang bang governor.
Say 'Y' here if you want to use two point temperature regulation
used for fans without throttling. Some fan drivers depend on this
governor to be enabled (e.g. acerhdf).
config THERMAL_GOV_USER_SPACE
bool "User_space thermal governor"
help
Enable this to let the user space manage the platform thermals.
config THERMAL_GOV_POWER_ALLOCATOR
bool "Power allocator thermal governor"
help
Enable this to manage platform thermals by dynamically
allocating and limiting power to devices.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
config CPU_THERMAL
bool "generic cpu cooling support"
depends on CPU_FREQ
depends on THERMAL_OF
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
help
This implements the generic cpu cooling mechanism through frequency
reduction. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c).
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
This will be useful for platforms using the generic thermal interface
and not the ACPI interface.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
If you want this support, you should say Y here.
thermal: introduce clock cooling device This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-01-06 17:04:18 +04:00
config CLOCK_THERMAL
bool "Generic clock cooling support"
depends on COMMON_CLK
depends on PM_OPP
help
This entry implements the generic clock cooling mechanism through
frequency clipping. Typically used to cool off co-processors. The
device that is configured to use this cooling mechanism will be
controlled to reduce clock frequency whenever temperature is high.
config DEVFREQ_THERMAL
bool "Generic device cooling support"
depends on PM_DEVFREQ
depends on PM_OPP
help
This implements the generic devfreq cooling mechanism through
frequency reduction for devices using devfreq.
This will throttle the device by limiting the maximum allowed DVFS
frequency corresponding to the cooling level.
In order to use the power extensions of the cooling device,
devfreq should use the simple_ondemand governor.
thermal: introduce clock cooling device This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-01-06 17:04:18 +04:00
If you want this support, you should say Y here.
config THERMAL_EMULATION
bool "Thermal emulation mode support"
help
Enable this option to make a emul_temp sysfs node in thermal zone
directory to support temperature emulation. With emulation sysfs node,
user can manually input temperature and test the different trip
threshold behaviour for simulation purpose.
WARNING: Be careful while enabling this option on production systems,
because userland can easily disable the thermal policy by simply
flooding this sysfs node with low temperature values.
config HISI_THERMAL
tristate "Hisilicon thermal driver"
depends on ARCH_HISI || COMPILE_TEST
depends on HAS_IOMEM
depends on OF
default y
help
Enable this to plug hisilicon's thermal sensor driver into the Linux
thermal framework. cpufreq is used as the cooling device to throttle
CPUs when the passive trip is crossed.
config IMX_THERMAL
tristate "Temperature sensor driver for Freescale i.MX SoCs"
depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
depends on MFD_SYSCON
depends on OF
help
Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
It supports one critical trip point and one passive trip point. The
cpufreq is used as the cooling device to throttle CPUs when the
passive trip is crossed.
config MAX77620_THERMAL
tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
depends on MFD_MAX77620
depends on OF
help
Support for die junction temperature warning alarm for Maxim
Semiconductor PMIC MAX77620 device. Device generates two alarm
interrupts when PMIC die temperature cross the threshold of
120 degC and 140 degC.
config QORIQ_THERMAL
tristate "QorIQ Thermal Monitoring Unit"
depends on THERMAL_OF
depends on HAS_IOMEM
help
Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
It supports one critical trip point and one passive trip point. The
cpufreq is used as the cooling device to throttle CPUs when the
passive trip is crossed.
config SPEAR_THERMAL
tristate "SPEAr thermal sensor driver"
depends on PLAT_SPEAR || COMPILE_TEST
depends on HAS_IOMEM
depends on OF
help
Enable this to plug the SPEAr thermal sensor driver into the Linux
thermal framework.
config ROCKCHIP_THERMAL
tristate "Rockchip thermal driver"
depends on ARCH_ROCKCHIP || COMPILE_TEST
depends on RESET_CONTROLLER
depends on HAS_IOMEM
help
Rockchip thermal driver provides support for Temperature sensor
ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
trip point. Cpufreq is used as the cooling device and will throttle
CPUs when the Temperature crosses the passive trip point.
config RCAR_THERMAL
tristate "Renesas R-Car thermal driver"
depends on ARCH_RENESAS || COMPILE_TEST
depends on HAS_IOMEM
help
Enable this to plug the R-Car thermal sensor driver into the Linux
thermal framework.
config RCAR_GEN3_THERMAL
tristate "Renesas R-Car Gen3 thermal driver"
depends on ARCH_RENESAS || COMPILE_TEST
depends on HAS_IOMEM
depends on OF
help
Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux
thermal framework.
config KIRKWOOD_THERMAL
tristate "Temperature sensor on Marvell Kirkwood SoCs"
depends on MACH_KIRKWOOD || COMPILE_TEST
depends on HAS_IOMEM
depends on OF
help
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
config DOVE_THERMAL
tristate "Temperature sensor on Marvell Dove SoCs"
depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
depends on HAS_IOMEM
depends on OF
help
Support for the Dove thermal sensor driver in the Linux thermal
framework.
config DB8500_THERMAL
tristate "DB8500 thermal management"
depends on MFD_DB8500_PRCMU
default y
help
Adds DB8500 thermal management implementation according to the thermal
management framework. A thermal zone with several trip points will be
created. Cooling devices can be bound to the trip points to cool this
thermal zone if trip points reached.
config ARMADA_THERMAL
tristate "Armada 370/XP thermal management"
depends on ARCH_MVEBU || COMPILE_TEST
depends on HAS_IOMEM
depends on OF
help
Enable this option if you want to have support for thermal management
controller present in Armada 370 and Armada XP SoC.
thermal: da9062/61: Thermal junction temperature monitoring driver Add junction temperature monitoring supervisor device driver, compatible with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added. If the PMIC's internal junction temperature rises above T_WARN (125 degC) an interrupt is issued. This T_WARN level is defined as the THERMAL_TRIP_HOT trip-wire inside the device driver. The thermal triggering mechanism is interrupt based and happens when the temperature rises above a given threshold level. The component cannot return an exact temperature, it only has knowledge if the temperature is above or below a given threshold value. A status bit must be polled to detect when the temperature falls below that threshold level again. A kernel work queue is configured to repeatedly poll and detect when the temperature falls below this trip-wire, between 1 and 10 second intervals (defaulting at 3 seconds). This scheme is provided as an example. It would be expected that any final implementation will also include a notify() function and any of these settings could be altered to match the application where appropriate. When over-temperature is reached, the interrupt from the DA9061/2 will be repeatedly triggered. The IRQ is therefore disabled when the first over-temperature event happens and the status bit is polled using a work-queue until it becomes false. This strategy is designed to allow the periodic transmission of uevents (HOT trip point) as the first level of temperature supervision method. It is intended for non-invasive temperature control, where the necessary measures for cooling the system down are left to the host software. Once the temperature falls again, the IRQ is re-enabled so a new critical over-temperature event can be detected. Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-28 17:43:33 +03:00
config DA9062_THERMAL
tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
depends on MFD_DA9062 || COMPILE_TEST
depends on OF
help
Enable this for the Dialog Semiconductor thermal sensor driver.
This will report PMIC junction over-temperature for one thermal trip
zone.
Compatible with the DA9062 and DA9061 PMICs.
config INTEL_POWERCLAMP
tristate "Intel PowerClamp idle injection driver"
depends on THERMAL
depends on X86
depends on CPU_SUP_INTEL
help
Enable this to enable Intel PowerClamp idle injection driver. This
enforce idle time which results in more package C-state residency. The
user interface is exposed via generic thermal framework.
config X86_PKG_TEMP_THERMAL
tristate "X86 package temperature thermal driver"
depends on X86_THERMAL_VECTOR
select THERMAL_GOV_USER_SPACE
select THERMAL_WRITABLE_TRIPS
default m
help
Enable this to register CPU digital sensor for package temperature as
thermal zone. Each package will have its own thermal zone. There are
two trip points which can be set by user to get notifications via thermal
notification methods.
config INTEL_SOC_DTS_IOSF_CORE
tristate
depends on X86
select IOSF_MBI
help
This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
implements the common set of helper functions to register, get temperature
and get/set thresholds on DTSs.
config INTEL_SOC_DTS_THERMAL
tristate "Intel SoCs DTS thermal driver"
depends on X86
select INTEL_SOC_DTS_IOSF_CORE
select THERMAL_WRITABLE_TRIPS
help
Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
temperature sensor (DTS). These SoCs have two additional DTSs in
addition to DTSs on CPU cores. Each DTS will be registered as a
thermal zone. There are two trip points. One of the trip point can
be set by user mode programs to get notifications via Linux thermal
notification methods.The other trip is a critical trip point, which
was set by the driver based on the TJ MAX temperature.
config INTEL_QUARK_DTS_THERMAL
tristate "Intel Quark DTS thermal driver"
depends on X86_INTEL_QUARK
help
Enable this to register Intel Quark SoC (e.g. X1000) platform digital
temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
The DTS will be registered as a thermal zone. There are two trip points:
hot & critical. The critical trip point default value is set by
underlying BIOS/Firmware.
menu "ACPI INT340X thermal drivers"
source drivers/thermal/int340x_thermal/Kconfig
endmenu
config INTEL_BXT_PMIC_THERMAL
tristate "Intel Broxton PMIC thermal driver"
depends on X86 && INTEL_SOC_PMIC_BXTWC && REGMAP
help
Select this driver for Intel Broxton PMIC with ADC channels monitoring
system temperature measurements and alerts.
This driver is used for monitoring the ADC channels of PMIC and handles
the alert trip point interrupts and notifies the thermal framework with
the trip point and temperature details of the zone.
config INTEL_PCH_THERMAL
tristate "Intel PCH Thermal Reporting Driver"
depends on X86 && PCI
help
Enable this to support thermal reporting on certain intel PCHs.
Thermal reporting device will provide temperature reading,
programmable trip points and other information.
config MTK_THERMAL
tristate "Temperature sensor driver for mediatek SoCs"
depends on ARCH_MEDIATEK || COMPILE_TEST
depends on HAS_IOMEM
depends on NVMEM || NVMEM=n
depends on RESET_CONTROLLER
default y
help
Enable this option if you want to have support for thermal management
controller present in Mediatek SoCs
menu "Broadcom thermal drivers"
depends on ARCH_BCM || COMPILE_TEST
source "drivers/thermal/broadcom/Kconfig"
endmenu
menu "Texas Instruments thermal drivers"
depends on ARCH_HAS_BANDGAP || COMPILE_TEST
depends on HAS_IOMEM
source "drivers/thermal/ti-soc-thermal/Kconfig"
endmenu
menu "Samsung thermal drivers"
depends on ARCH_EXYNOS || COMPILE_TEST
source "drivers/thermal/samsung/Kconfig"
endmenu
menu "STMicroelectronics thermal drivers"
depends on ARCH_STI && OF
source "drivers/thermal/st/Kconfig"
endmenu
config TANGO_THERMAL
tristate "Tango thermal management"
depends on ARCH_TANGO || COMPILE_TEST
help
Enable the Tango thermal driver, which supports the primitive
temperature sensor embedded in Tango chips since the SMP8758.
This sensor only generates a 1-bit signal to indicate whether
the die temperature exceeds a programmable threshold.
source "drivers/thermal/tegra/Kconfig"
config QCOM_SPMI_TEMP_ALARM
tristate "Qualcomm SPMI PMIC Temperature Alarm"
depends on OF && SPMI && IIO
select REGMAP_SPMI
help
This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
PMIC devices. It shows up in sysfs as a thermal sensor with multiple
trip points. The temperature reported by the thermal sensor reflects the
real time die temperature if an ADC is present or an estimate of the
temperature based upon the over temperature stage value.
config GENERIC_ADC_THERMAL
tristate "Generic ADC based thermal sensor"
depends on IIO
help
This enabled a thermal sysfs driver for the temperature sensor
which is connected to the General Purpose ADC. The ADC channel
is read via IIO framework and the channel information is provided
to this driver. This driver reports the temperature by reading ADC
channel and converts it to temperature based on lookup table.
menu "Qualcomm thermal drivers"
depends on (ARCH_QCOM && OF) || COMPILE_TEST
source "drivers/thermal/qcom/Kconfig"
endmenu
config ZX2967_THERMAL
tristate "Thermal sensors on zx2967 SoC"
depends on ARCH_ZX || COMPILE_TEST
help
Enable the zx2967 thermal sensors driver, which supports
the primitive temperature sensor embedded in zx2967 SoCs.
This sensor generates the real time die temperature.
endif