microsoft
/
WSL2-Linux-Kernel
зеркало из https://github.com/microsoft/WSL2-Linux-Kernel.git
1
0
Форкнуть 0
Код Задачи Пакеты Проекты Релизы Вики Активность
WSL2-Linux-Kernel/drivers/thermal/Makefile

27 строки
866 B
Makefile
Исходник Обычный вид История

the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 10:51:08 +03:00
#
# Makefile for sensor chip drivers.
#
thermal: add the support for building the generic thermal as a module Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-21 12:07:13 +04:00
obj-$(CONFIG_THERMAL) += thermal_sys.o
Thermal: rename thermal_sys.c to thermal_core.c this is the preparation work to build all the thermal core framework source file, like governors, cpu cooling, etc, into one module. No functional change in this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-03-26 10:59:18 +04:00
thermal_sys-y += thermal_core.o
drivers/thermal/Makefile refactor Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 12:07:46 +04:00
# governors
Thermal: build thermal governors into thermal_sys module The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-03-26 12:38:29 +04:00
thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += fair_share.o
thermal_sys-$(CONFIG_THERMAL_GOV_STEP_WISE) += step_wise.o
thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
drivers/thermal/Makefile refactor Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 12:07:46 +04:00
# cpufreq cooling
Thermal: build cpu_cooling code into thermal_sys module Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-03-26 19:57:01 +04:00
thermal_sys-$(CONFIG_CPU_THERMAL) += cpu_cooling.o
drivers/thermal/Makefile refactor Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 12:07:46 +04:00
# platform thermal drivers
obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
thermal: add Renesas R-Car thermal sensor support This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-07-21 04:53:48 +04:00
obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
thermal: Add support for the thermal sensor on Kirkwood SoCs This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 10:35:24 +04:00
obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
drivers/thermal/Makefile refactor Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 12:07:46 +04:00
obj-$(CONFIG_EXYNOS_THERMAL) += exynos_thermal.o
Thermal: Dove: Add Themal sensor support for Dove. The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 10:35:26 +04:00
obj-$(CONFIG_DOVE_THERMAL) += dove_thermal.o
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 14:56:42 +04:00
obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
thermal: Add driver for Armada 370/XP SoC thermal management This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 05:37:41 +04:00
obj-$(CONFIG_ARMADA_THERMAL) += armada_thermal.o
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 14:56:42 +04:00
obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o
PM: Introduce Intel PowerClamp Driver Intel PowerClamp driver performs synchronized idle injection across all online CPUs. The goal is to maintain a given package level C-state ratio. Compared to other throttling methods already exist in the kernel, such as ACPI PAD (taking CPUs offline) and clock modulation, this is often more efficient in terms of performance per watt. Please refer to Documentation/thermal/intel_powerclamp.txt for more details. Signed-off-by: Arjan van de Ven <arjan@linux.intel.com> Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-21 16:37:57 +04:00
obj-$(CONFIG_INTEL_POWERCLAMP) += intel_powerclamp.o