thermal: exynos: Move exynos_thermal.h from include/* to driver/* folder
This patch renames and moves include/linux/platform_data/exynos_thermal.h to drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos SOC's are not supporting non-DT based platforms and this file now just contains exynos tmu driver related definations. Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes the compilation issue occuring because now this new tmu header file is included in tmu driver c file and not in the common thermal header file. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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@ -22,7 +22,6 @@
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#include <linux/cpu_cooling.h>
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#include <linux/err.h>
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#include <linux/platform_data/exynos_thermal.h>
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#include <linux/slab.h>
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#include <linux/thermal.h>
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@ -44,6 +44,22 @@
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#define EXYNOS_ZONE_COUNT 3
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/**
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* struct freq_clip_table
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* @freq_clip_max: maximum frequency allowed for this cooling state.
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* @temp_level: Temperature level at which the temperature clipping will
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* happen.
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* @mask_val: cpumask of the allowed cpu's where the clipping will take place.
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*
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* This structure is required to be filled and passed to the
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* cpufreq_cooling_unregister function.
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*/
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struct freq_clip_table {
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unsigned int freq_clip_max;
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unsigned int temp_level;
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const struct cpumask *mask_val;
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};
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struct thermal_trip_point_conf {
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int trip_val[MAX_TRIP_COUNT];
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int trip_count;
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@ -27,9 +27,9 @@
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#include <linux/module.h>
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#include <linux/of.h>
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#include <linux/platform_device.h>
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#include <linux/platform_data/exynos_thermal.h>
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#include "exynos_thermal_common.h"
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#include "exynos_tmu.h"
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/* Exynos generic registers */
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#define EXYNOS_TMU_REG_TRIMINFO 0x0
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@ -1,8 +1,9 @@
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/*
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* exynos_thermal.h - Samsung EXYNOS TMU (Thermal Management Unit)
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* exynos_tmu.h - Samsung EXYNOS TMU (Thermal Management Unit)
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*
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* Copyright (C) 2011 Samsung Electronics
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* Donggeun Kim <dg77.kim@samsung.com>
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* Amit Daniel Kachhap <amit.daniel@samsung.com>
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*
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* This program is free software; you can redistribute it and/or modify
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* it under the terms of the GNU General Public License as published by
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@ -19,10 +20,12 @@
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* Foundation, Inc., 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA
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*/
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#ifndef _LINUX_EXYNOS_THERMAL_H
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#define _LINUX_EXYNOS_THERMAL_H
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#ifndef _EXYNOS_TMU_H
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#define _EXYNOS_TMU_H
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#include <linux/cpu_cooling.h>
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#include "exynos_thermal_common.h"
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enum calibration_type {
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TYPE_ONE_POINT_TRIMMING,
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TYPE_TWO_POINT_TRIMMING,
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@ -33,21 +36,6 @@ enum soc_type {
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SOC_ARCH_EXYNOS4210 = 1,
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SOC_ARCH_EXYNOS,
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};
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/**
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* struct freq_clip_table
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* @freq_clip_max: maximum frequency allowed for this cooling state.
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* @temp_level: Temperature level at which the temperature clipping will
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* happen.
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* @mask_val: cpumask of the allowed cpu's where the clipping will take place.
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*
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* This structure is required to be filled and passed to the
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* cpufreq_cooling_unregister function.
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*/
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struct freq_clip_table {
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unsigned int freq_clip_max;
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unsigned int temp_level;
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const struct cpumask *mask_val;
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};
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/**
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* struct exynos_tmu_platform_data
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@ -116,4 +104,4 @@ struct exynos_tmu_platform_data {
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struct freq_clip_table freq_tab[4];
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unsigned int freq_tab_count;
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};
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#endif /* _LINUX_EXYNOS_THERMAL_H */
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#endif /* _EXYNOS_TMU_H */
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