Moving the bcm2835 thermal driver to the broadcom directory prevented it
from getting enabled for arm64 builds, since the broadcom directory is only
available when 32-bit specific ARCH_BCM is set.
Fix this by enabling the Broadcom menu for ARCH_BCM or ARCH_BCM2835.
Fixes: 6892cf07e7 ("thermal: bcm2835: move to the broadcom subdirectory")
Reviewed-by: Eric Anholt <eric@anholt.net>
Signed-off-by: Allen Wild <allenwild93@gmail.com>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The driver now fails to link into vmlinux when CONFIG_NVMEM is a loadable
module:
drivers/thermal/imx_thermal.o: In function `imx_thermal_probe':
imx_thermal.c:(.text+0x360): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x360): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'
This adds a Kconfig dependency to force it to be a module as well
when its dependency is loadable.
Fixes: 7fe5ba04fcdc ("thermal: imx: Add support for reading OCOTP through nvmem")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Leonard Crestez <leonard.crestez@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
We get a Kconfig warning when selecting this without also enabling
CONFIG_PCI:
warning: (X86_INTEL_LPSS && INTEL_SOC_DTS_IOSF_CORE
&& SND_SST_IPC_ACPI && MMC_SDHCI_ACPI && PUNIT_ATOM_DEBUG)
selects IOSF_MBI which has unmet direct dependencies (PCI)
This adds a new depedency.
Fixes: 3a2419f865 ("Thermal: Intel SoC: DTS thermal use common APIs")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
- Fix a problem where orderly_shutdown() is called for multiple times
due to multiple critical overheating events raised in a short period
by platform thermal driver. (Keerthy)
- Introduce a backup thermal shutdown mechanism, which invokes
kernel_power_off()/emergency_restart() directly, after
orderly_shutdown() being issued for certain amount of time(specified
via Kconfig). This is useful in certain conditions that userspace may
be unable to power off the system in a clean manner and leaves the
system in a critical state, like in the middle of driver probing
phase. (Keerthy)
- Introduce a new interface in thermal devfreq_cooling code so that the
driver can provide more precise data regarding actual power to the
thermal governor every time the power budget is calculated. (Lukasz
Luba)
- Introduce BCM 2835 soc thermal driver and northstar thermal driver,
within a new sub-folder. (Rafał Miłecki)
- Introduce DA9062/61 thermal driver. (Steve Twiss)
- Remove non-DT booting on TI-SoC driver. Also add support to fetching
coefficients from DT. (Keerthy)
- Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund)
- Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien,
Brian Bian)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
thermal: core: Add a back up thermal shutdown mechanism
thermal: core: Allow orderly_poweroff to be called only once
Thermal: Intel SoC DTS: Change interrupt request behavior
trace: thermal: add another parameter 'power' to the tracing function
thermal: devfreq_cooling: add new interface for direct power read
thermal: devfreq_cooling: refactor code and add get_voltage function
thermal: mt8173: minor mtk_thermal.c cleanups
thermal: bcm2835: move to the broadcom subdirectory
thermal: broadcom: ns: specify myself as MODULE_AUTHOR
thermal: da9062/61: Thermal junction temperature monitoring driver
Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding
thermal: broadcom: add Northstar thermal driver
dt-bindings: thermal: add support for Broadcom's Northstar thermal
thermal: bcm2835: add thermal driver for bcm2835 SoC
dt-bindings: Add thermal zone to bcm2835-thermal example
thermal: rcar_gen3_thermal: add suspend and resume support
thermal: rcar_gen3_thermal: store device match data in private structure
thermal: rcar_gen3_thermal: enable hardware interrupts for trip points
thermal: rcar_gen3_thermal: record and check number of TSCs found
thermal: rcar_gen3_thermal: check that TSC exists before memory allocation
...
orderly_poweroff is triggered when a graceful shutdown
of system is desired. This may be used in many critical states of the
kernel such as when subsystems detects conditions such as critical
temperature conditions. However, in certain conditions in system
boot up sequences like those in the middle of driver probes being
initiated, userspace will be unable to power off the system in a clean
manner and leaves the system in a critical state. In cases like these,
the /sbin/poweroff will return success (having forked off to attempt
powering off the system. However, the system overall will fail to
completely poweroff (since other modules will be probed) and the system
is still functional with no userspace (since that would have shut itself
off).
However, there is no clean way of detecting such failure of userspace
powering off the system. In such scenarios, it is necessary for a backup
workqueue to be able to force a shutdown of the system when orderly
shutdown is not successful after a configurable time period.
Reported-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Crystal Cove and Whiskey Cove are two different PMICs which are
installed on Intel Atom SoC based platforms.
Moreover there are two independent drivers that by some reason were
supposed (*) to get into one kernel module.
Fix the mess by clarifying Kconfig option for Crystal Cove and split
Whiskey Cove out of it.
(*) It looks like the configuration was never tested with
INTEL_SOC_PMIC=n. The line in Makefile is actually wrong.
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> (supporter:ACPI)
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.
If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.
The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).
This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.
When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.
This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add basic thermal driver for bcm2835 SoC.
This driver currently make sure that tsense HW block is set up
correctly.
Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The best place to register the CPU cooling device is from the cpufreq
driver as we would know if all the resources are already available or
not. That's what is done for the cpufreq-dt.c driver as well.
The cpu-cooling driver for dbx500 platform was just (un)registering
with the thermal framework and that can be handled easily by the cpufreq
driver as well and in proper sequence as well.
Get rid of the cooling driver and its its users and manage everything
from the cpufreq driver instead.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.
Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal driver is standalone driver which is used to enable
thermal sensors, so it can be used with any cooling device and
should not bind with CPU cooling device driver.
This original patch is suggested by Amit Kucheria; so it's to
polish the dependency in Kconfig, and remove the dependency with
CPU_THERMAL.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Not much use unless the SoC is selected so depend on the ARCH_MXC
and COMPILE_TEST like all the other thermal drivers.
v2: drop extraneous OF
Signed-off-by: Peter Robinson <pbrobinson@gmail.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.
It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.
Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.
Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.
Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This change adds support for Intel BXT Whiskey Cove PMIC thermal
driver which is intended to handle the alert interrupts triggered
upon thermal trip point cross and notify the thermal framework
appropriately with the zone, temp, crossed trip and event details.
Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com>
Signed-off-by: Bin Gao <bin.gao@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
- Introduce generic ADC thermal driver, based on OF thermal (Laxman
Dewangan)
- Introduce new thermal driver for Tango chips (Marc Gonzalez)
- Rockchip driver support for RK3399, RK3366, and some fixes (Caesar
Wang, Elaine Zhang and Shawn Lin)
- Add CPU power cooling model to Mediatek thermal driver (Dawei Chien)
- Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin)
- TI thermal driver gained a new maintainer (Keerthy).
- Enabled powerclamp driver by checking CPU feature and package cstate
counter instead of CPU whitelist (Jacob Pan)
- Various fixes on thermal governor, OF thermal, Tegra, and RCAR
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits)
thermal: tango: initialize TEMPSI_CFG
thermal: rockchip: use the usleep_range instead of udelay
thermal: rockchip: add the notes for better reading
thermal: rockchip: Support RK3366 SoCs in the thermal driver
thermal: rockchip: handle the power sequence for tsadc controller
thermal: rockchip: update the tsadc table for rk3399
thermal: rockchip: fixes the code_to_temp for tsadc driver
thermal: rockchip: disable thermal->clk in err case
thermal: tegra: add Tegra132 specific SOC_THERM driver
thermal: fix ptr_ret.cocci warnings
thermal: mediatek: Add cpu dynamic power cooling model.
thermal: generic-adc: Add ADC based thermal sensor driver
thermal: generic-adc: Add DT binding for ADC based thermal sensor
thermal: tegra: fix static checker warning
thermal: tegra: mark PM functions __maybe_unused
thermal: add temperature sensor support for tango SoC
thermal: hisilicon: fix IRQ imbalance enabling
thermal: hisilicon: support to use any sensor
thermal: rcar: Remove binding docs for r8a7794
thermal: tegra: add PM support
...
In some of platform, thermal sensors like NCT thermistors are
connected to the one of ADC channel. The temperature is read by
reading the voltage across the sensor resistance via ADC. Lookup
table for ADC read value to temperature is referred to get
temperature. ADC is read via IIO framework.
Add support for thermal sensor driver which read the voltage across
sensor resistance from ADC through IIO framework.
Acked-by: Jonathan Cameron <jic23@kernel.org>
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.
This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.
Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Move Tegra soctherm driver to tegra directory, it's easy to maintain
and add more new function support for Tegra platforms.
This will also help to split soctherm driver into common parts and
chip specific data related parts.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
INT3406 ACPI device object resembles an ACPI video output device, but its
_BCM is said to be deprecated and should not be used. So we will make
use of the raw interface to do the actual cooling.
Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
At least with CONFIG_COMPILE_TEST, there's no reason to assume
that CONFIG_RESET_CONTROLLER is set, but the code for this
controller requires it since it calls device_reset().
Make CONFIG_MTK_THERMAL properly depend on CONFIG_RESET_CONTROLLER.
Signed-off-by: Johannes Berg <johannes.berg@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:
drivers/built-in.o: In function `kirkwood_thermal_probe':
kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource'
drivers/built-in.o: In function `exynos_tmu_probe':
exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap'
The users of devm_ioremap_resource() which are compile-testable should
depend on HAS_IOMEM.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Make use of ARCH_RENESAS in place of ARCH_SHMOBILE.
This is part of an ongoing process to migrate from ARCH_SHMOBILE to
ARCH_RENESAS the motivation for which being that RENESAS seems to be a more
appropriate name than SHMOBILE for the majority of Renesas ARM based SoCs.
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This driver only has runtime but no build time dependencies, so it can be
built for testing purposes if the Kconfig COMPILE_TEST option is enabled.
This is useful to have more build coverage and make sure that drivers are
not affected by changes that could cause build regressions.
Signed-off-by: Luis de Bethencourt <luisbg@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This adds support for the Mediatek thermal controller found on MT8173
and likely other SoCs.
The controller is a bit special. It does not have its own ADC, instead
it controls the on-SoC AUXADC via AHB bus accesses. For this reason
we need the physical address of the AUXADC. Also it controls a mux
using AHB bus accesses, so we need the APMIXEDSYS physical address aswell.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When the thermal subsystem is a loadable module, the u8500 driver
fails to build:
drivers/thermal/built-in.o: In function `db8500_thermal_probe':
db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register'
drivers/thermal/built-in.o: In function `db8500_thermal_work':
db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update'
This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When the thermal subsystem is a loadable module, the spear driver
fails to build:
drivers/thermal/built-in.o: In function `spear_thermal_exit':
spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister'
drivers/thermal/built-in.o: In function `spear_thermal_probe':
spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register'
This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This just caused build errors:
warning: (QCOM_SPMI_TEMP_ALARM) selects REGMAP_SPMI which has unmet direct dependencies (SPMI)
drivers/built-in.o: In function `regmap_spmi_ext_gather_write':
:(.text+0x609b0): undefined reference to `spmi_ext_register_write'
:(.text+0x609f0): undefined reference to `spmi_ext_register_writel'
While it's generally a good idea to allow compile testing, in this
case, it just doesn't work, so reverting the patch that
introduced the compile-test variant seems the most appropriate
solution.
Note that SPMI also has a 'depends on ARCH_QCOM || COMPILE_TEST'
statement, so we should be able to enable SPMI on all architectures
for compile testing already.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: cb7fb4d342 ("thermal: qcom_spmi: allow compile test")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.
The device must use devfreq. In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
After the commit "thermal: core: Add Kconfig option to enable writable
trips", by default the trips are read only. This cause user space thermal
controllers to poll for temperature as they can't set temperature
thresholds for getting a notification via uevents. These programs use RW
trip in a zone to register thresholds. Since we need to enable the new
config introduced by above commit to allow writable trips, selecting
CONFIG_THERMAL_WRITABLE_TRIP for x86 thermal drivers.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
This change adds a thermal driver for Wildcat Point platform controller
hub. This driver register PCH thermal sensor as a thermal zone and
associate critical and hot trips if present.
Signed-off-by: Tushar Dave <tushar.n.dave@intel.com>
Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped. Remove the select as it is not doing anything.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: Valentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.
The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.
This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.
The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.
Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.
Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.
However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.
There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.
Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".
User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/
For example:
- to read DTS temperature
$ cat temp
- to read critical trip point
$ cat trip_point_0_temp
- to read trip point type
$ cat trip_point_0_type
- to emulate temperature raise to test orderly shutdown by Linux distro
$ echo 105 > emul_temp
Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Support two auxiliary DTS present on Braswell platform using side band
IOSF interface. This supports two read write trips, which can be used
to get notification on trip violation.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
There is no change in functionality but using the common IOSF core APIs.
This driver is now just responsible for enumeration and call relevant
API to create thermal zone and register critical trip.
Also cpuid 0x4c is now handled in the int340x processor thermal driver
with the same functionality.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Thermal is TS-ADC Controller module supports
user-defined mode and automatic mode.
User-defined mode refers,TSADC all the control signals entirely by
software writing to register for direct control.
Automaic mode refers to the module automatically poll TSADC output,
and the results were checked.If you find that the temperature High
in a period of time,an interrupt is generated to the processor
down-measures taken;If the temperature over a period of time High,
the resulting TSHUT gave CRU module,let it reset the entire chip,
or via GPIO give PMIC.
Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This adds support for the Tegra SOCTHERM thermal sensing and management
system found in the Tegra124 system-on-chip. This initial driver supports
temperature polling for four thermal zones.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch introduces a new thermal cooling device based on common clock
framework. The original motivation to write this cooling device is to be
able to cool down thermal zones using clocks that feed co-processors, such
as GPUs, DSPs, Image Processing Co-processors, etc. But it is written
in a way that it can be used on top of any clock.
The implementation is pretty straight forward. The code creates
a thermal cooling device based on a pair of a struct device and a clock name.
The struct device is assumed to be usable by the OPP layer. The OPP layer
is used as source of the list of possible frequencies. The (cpufreq) frequency
table is then used as a map from frequencies to cooling states. Cooling
states are indexes to the frequency table.
The logic sits on top of common clock framework, specifically on clock
pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is
only allowed when the new rate is within the thermal limit (cooling state -> freq).
When a thermal cooling device state transition is requested, the clock
is also checked to verify if the current clock rate is within the new
thermal limit.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Len Brown <len.brown@intel.com>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Pull thermal management updates from Zhang Rui:
"Sorry that I missed the merge window as there is a bug found in the
last minute, and I have to fix it and wait for the code to be tested
in linux-next tree for a few days. Now the buggy patch has been
dropped entirely from my next branch. Thus I hope those changes can
still be merged in 3.18-rc2 as most of them are platform thermal
driver changes.
Specifics:
- introduce ACPI INT340X thermal drivers.
Newer laptops and tablets may have thermal sensors and other
devices with thermal control capabilities that are exposed for the
OS to use via the ACPI INT340x device objects. Several drivers are
introduced to expose the temperature information and cooling
ability from these objects to user-space via the normal thermal
framework.
From: Lu Aaron, Lan Tianyu, Jacob Pan and Zhang Rui.
- introduce a new thermal governor, which just uses a hysteresis to
switch abruptly on/off a cooling device. This governor can be used
to control certain fan devices that can not be throttled but just
switched on or off. From: Peter Feuerer.
- introduce support for some new thermal interrupt functions on
i.MX6SX, in IMX thermal driver. From: Anson, Huang.
- introduce tracing support on thermal framework. From: Punit
Agrawal.
- small fixes in OF thermal and thermal step_wise governor"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
Thermal: int340x thermal: select ACPI fan driver
Thermal: int3400_thermal: use acpi_thermal_rel parsing APIs
Thermal: int340x_thermal: expose acpi thermal relationship tables
Thermal: introduce int3403 thermal driver
Thermal: introduce INT3402 thermal driver
Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.h
ACPI / Fan: support INT3404 thermal device
ACPI / Fan: add ACPI 4.0 style fan support
ACPI / fan: convert to platform driver
ACPI / fan: use acpi_device_xxx_power instead of acpi_bus equivelant
ACPI / fan: remove no need check for device pointer
ACPI / fan: remove unused macro
Thermal: int3400 thermal: register to thermal framework
Thermal: int3400 thermal: add capability to detect supporting UUIDs
Thermal: introduce int3400 thermal driver
ACPI: add ACPI_TYPE_LOCAL_REFERENCE support to acpi_extract_package()
ACPI: make acpi_create_platform_device() an external API
thermal: step_wise: fix: Prevent from binary overflow when trend is dropping
ACPI: introduce ACPI int340x thermal scan handler
thermal: Added Bang-bang thermal governor
...
we share the same driver for both ACPI predefined Fan device
and INT3404 Fan device, thus we should select the ACPI Fan
driver when int340x thermal drivers are enabeld.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
ACPI 4.0 introduced two thermal relationship tables via _ART
(active cooling) and _TRT (passive cooling) objects. These
tables contain many to many relationships among thermal sensors
and cooling devices.
This patch parses _ART and _TRT and makes the result available to
the userspace via an misc device interface. At the same time,
kernel drivers can also request parsing results from internal
kernel APIs.
The results include source and target devices, influence, and
sampling rate in case of _TRT. For _ART, the result shows source
device, target device, and weight percentage.
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.
The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.
Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Newer laptops and tablets that use ACPI may have thermal sensors and
other devices with thermal control capabilities outside the core CPU/SOC,
for thermal safety reasons.
They are exposed for the OS to use via
1) INT3400 ACPI device object as the master.
2) INT3401 ~ INT340B ACPI device objects as the slaves.
This patch introduces a scan handler to enumerate the INT3400
ACPI device object to platform bus, and prevent its slaves
from being enumerated before the controller driver being probed.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
mach-kirkwood has been removed, now that kirkwood lives in mach-mvebu.
Depend on MACH_KIRKWOOD, which will be set when kirkwood is built as
part of ARCH_MVEBU.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Link: https://lkml.kernel.org/r/1409417172-6846-4-git-send-email-andrew@lunn.ch
Signed-off-by: Jason Cooper <jason@lakedaemon.net>
The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device. It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only. For those special devices the driver needs to
explicitely request it.
Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
DT-enabled Dove has moved from ARCH_DOVE in mach-dove to MACH_DOVE
in mach-mvebu. As non-DT ARCH_DOVE will stay to rot for a while, add a new
DT-only MACH_DOVE to thermal Kconfig.
This was originally supposed to go in via "ARM: dove: prepare new Dove DT Kconfig"
patch from Sebastian Hesselbarth for 3.15, but slipped through the cracks.
I've tested on CuBox that without this patch you can't compile
dove_thermal into a mach-mvebu based kernel, and with this patch I can
build the driver and it works as expected run-time.
v2: non-ascii char creeped in somehow
Signed-off-by: Riku Voipio <riku.voipio@linaro.org>
Cc: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This core is shared by both ST's 'memory mapped' and
'system configuration register' based Thermal controllers.
Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.
The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Menu for Samsung thermal support is visible on all Samsung
platforms while thermal drivers are currently available only
for EXYNOS SoCs. Fix it by replacing PLAT_SAMSUNG dependency
with ARCH_EXYNOS one.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
These changes are mostly for ARM specific device drivers that either
don't have an upstream maintainer, or that had the maintainer ask
us to pick up the changes to avoid conflicts. A large chunk of this
are clock drivers (bcm281xx, exynos, versatile, shmobile), aside from
that, reset controllers for STi as well as a large rework of the
Marvell Orion/EBU watchdog driver are notable.
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Merge tag 'drivers-3.15' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc
Pull ARM SoC driver changes from Arnd Bergmann:
"These changes are mostly for ARM specific device drivers that either
don't have an upstream maintainer, or that had the maintainer ask us
to pick up the changes to avoid conflicts.
A large chunk of this are clock drivers (bcm281xx, exynos, versatile,
shmobile), aside from that, reset controllers for STi as well as a
large rework of the Marvell Orion/EBU watchdog driver are notable"
* tag 'drivers-3.15' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (99 commits)
Revert "dts: socfpga: Add DTS entry for adding the stmmac glue layer for stmmac."
Revert "net: stmmac: Add SOCFPGA glue driver"
ARM: shmobile: r8a7791: Fix SCIFA3-5 clocks
ARM: STi: Add reset controller support to mach-sti Kconfig
drivers: reset: stih416: add softreset controller
drivers: reset: stih415: add softreset controller
drivers: reset: Reset controller driver for STiH416
drivers: reset: Reset controller driver for STiH415
drivers: reset: STi SoC system configuration reset controller support
dts: socfpga: Add sysmgr node so the gmac can use to reference
dts: socfpga: Add support for SD/MMC on the SOCFPGA platform
reset: Add optional resets and stubs
ARM: shmobile: r7s72100: fix bus clock calculation
Power: Reset: Generalize qnap-poweroff to work on Synology devices.
dts: socfpga: Update clock entry to support multiple parents
ARM: socfpga: Update socfpga_defconfig
dts: socfpga: Add DTS entry for adding the stmmac glue layer for stmmac.
net: stmmac: Add SOCFPGA glue driver
watchdog: orion_wdt: Use %pa to print 'phys_addr_t'
drivers: cci: Export CCI PMU revision
...
Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST)
broke build on archs wihout io memory.
On archs like S390 or um this driver cannot build nor work.
Make it depend on HAS_IOMEM to bypass build failures.
drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource'
drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource'
Signed-off-by: Richard Weinberger <richard@nod.at>
Acked-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
With the move of kirkwood into mach-mvebu, drivers Kconfig need
tweeking to allow the kirkwood specific drivers to be built.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mark Brown <broonie@linaro.org>
Acked-by: Kishon Vijay Abraham I <kishon@ti.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Jason Gunthorpe <jgunthorpe@obsidianresearch.com>
Cc: Viresh Kumar <viresh.kumar@linaro.org>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Richard Purdie <rpurdie@rpsys.net>
Cc: Bryan Wu <cooloney@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Jason Cooper <jason@lakedaemon.net>
The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch introduces an API to register cpufreq cooling device
based on device tree node.
The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.
This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.
This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.
Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Pull thermal management updates from Zhang Rui:
"This time we only have a few changes as there are no soc thermal
changes from Eduardo. The only big change is the introduction of
TMON, a tool to help visualize, tune, and test the thermal subsystem.
The rest is mostly cleanups and fixes all over.
Specifics:
- introduce TMON, a tool base on thermal sysfs I/F. It can be used
to visualize, tune and test the thermal subsystem.
- fix a zone/cooling device binding problem, when both thermal zone
bind parameters and .bind() callback are available"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
tools/thermal: Introduce tmon, a tool for thermal subsystem
thermal: Fix binding problem when there is thermal zone params
thermal: cpu_cooling: fix return value check in cpufreq_cooling_register()
Thermal: Check for validity before doing kfree
thermal/intel_powerclamp: Add newer CPU models
Thermal: Tidy up error handling in powerclamp_init
thermal: Kconfig: cosmetic fixes
ACPI/thermal : Remove zone disabled warning
typo in drivers/thermal/Kconfig: lpatform instead of platform
CONFIG_CPU_FREQ_TABLE will be always enabled when cpufreq framework is used, as
cpufreq core depends on it. So, we don't need this CONFIG option anymore as it
is not configurable. Remove CONFIG_CPU_FREQ_TABLE and update its users.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.
In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid). Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.
It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs. The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.
Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Allen Wild
Arnd Bergmann
Zhang Rui
Kunihiko Hayashi
Linus Torvalds
Keerthy
Andy Shevchenko
Rafał Miłecki
Steve Twiss
Stefan Wahren
Viresh Kumar
Baoyou Xie
Wolfram Sang
Leo Yan
Laxman Dewangan
Peter Robinson
Jia Hongtao
Rajendra Nayak
Bin Gao
Marc Gonzalez
Wei Ni
Aaron Lu
Johannes Berg
Randy Dunlap
Eduardo Valentin
Krzysztof Kozlowski
Simon Horman
Luis de Bethencourt
Sascha Hauer
Ørjan Eide
Srinivas Pandruvada
Tushar Dave
kongxinwei
Javi Merino
Punit Agrawal
Ivan T. Ivanov
Ong, Boon Leong
Caesar Wang
Mikko Perttunen
Eduardo Valentin
Jacob Pan
Lan Tianyu
Andrew Lunn
Peter Feuerer
Riku Voipio
Lee Jones
Bartlomiej Zolnierkiewicz
Richard Weinberger
Laurent Pinchart
Luka Perkov
Regid Ichira
Amit Daniel Kachhap
Shawn Guo