Граф коммитов

14 Коммитов

Автор SHA1 Сообщение Дата
Viresh Kumar 4d753aa7b6 thermal: cpu_cooling: use cpufreq_policy to register cooling device
The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the
frequency table, etc. Most of the callers of CPU cooling driver's
registration routines have the cpufreq policy with them, but they only
pass the policy->related_cpus cpumask. The __cpufreq_cooling_register()
routine then gets the policy by itself and uses it.

It would be much better if the callers can pass the policy instead
directly. This also fixes a basic design flaw, where the policy can be
freed while the CPU cooling driver is still active.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:24 -07:00
Viresh Kumar 3e08b2df12 thermal: cpu_cooling: remove cpufreq_cooling_get_level()
There is only one user of cpufreq_cooling_get_level() and that already
has pointer to the cpufreq_cdev structure. It can directly call
get_level() instead and we can get rid of cpufreq_cooling_get_level().

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27 17:32:04 -07:00
Javi Merino c36cf07176 thermal: cpu_cooling: implement the power cooling device API
Add a basic power model to the cpu cooling device to implement the
power cooling device API.  The power model uses the current frequency,
current load and OPPs for the power calculations.  The cpus must have
registered their OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Javi Merino 503ccc3fec thermal: cpu_cooling: return ERR_PTR() for !CPU_THERMAL or !THERMAL_OF
The documentation of of_cpufreq_cooling_register() and
cpufreq_cooling_register() say that they return ERR_PTR() on error.
Accordingly, callers only check for IS_ERR().  Therefore, make them
return ERR_PTR(-ENOSYS) as is customary in the kernel when config
options are missing.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-17 09:00:04 -04:00
Eduardo Valentin 39d99cff76 thermal: cpu_cooling: introduce of_cpufreq_cooling_register
This patch introduces an API to register cpufreq cooling device
based on device tree node.

The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:33:34 -04:00
Arnd Bergmann e8d39240d6 thermal: cpu_cooling: fix stub function
The function stub for cpufreq_cooling_get_level introduced
in 57df81069 "Thermal: exynos: fix cooling state translation"
is not syntactically correct C and needs to be fixed to avoid
this error:

In file included from drivers/thermal/db8500_thermal.c:20:0:
 include/linux/cpu_cooling.h: In function 'cpufreq_cooling_get_level':
include/linux/cpu_cooling.h:57:1:
 error: parameter name omitted  unsigned long cpufreq_cooling_get_level(unsigned int, unsigned int)  ^
 include/linux/cpu_cooling.h:57:1: error: parameter name omitted

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Amit Daniel kachhap <amit.daniel@samsung.com>
Cc: stable@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-08 10:13:40 -04:00
Eduardo Valentin d44ada5162 thermal: cpu_cooling: improve line breaking
To improve code readiness, change the way the lines
are broken in this file.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-27 09:25:59 +08:00
Eduardo Valentin e44dec77be thermal: cpu_cooling: remove unused symbols on cpu_cooling.h
Remove defines that are not in used.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:45 +08:00
Eduardo Valentin 198f38f7fb thermal: cpu_cooling: add needed header for cpu_cooling.h
Update header list for cpu_cooling.h. Missing definition of cpumask.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:44 +08:00
Zhang Rui bbf7fc88c7 Thermal: build cpu_cooling code into thermal_sys module
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:49 +08:00
Zhang Rui 57df810693 Thermal: exynos: fix cooling state translation
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
2013-03-26 14:33:50 +08:00
Eduardo Valentin 4ba115b1e1 thermal: cpu cooling: allow module builds
As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
  generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y

with the following drive:
CONFIG_OMAP_BANDGAP=m

generates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!

This patch changes cpu cooling driver to allow it
to be built as module.

Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-22 15:59:52 +08:00
Eduardo Valentin 3778ff5c70 thermal: cpu cooling: use const parameter while registering
There are predefined cpu_masks that are const data structures.
This patch changes the cpu cooling register function so that
those const cpu_masks can be used, without compilation warnings.

include/linux/cpumask.h

 * The following particular system cpumasks and operations manage
 * possible, present, active and online cpus.
 *
 *     cpu_possible_mask- has bit 'cpu' set iff cpu is populatable
 *     cpu_present_mask - has bit 'cpu' set iff cpu is populated
 *     cpu_online_mask  - has bit 'cpu' set iff cpu available to scheduler
 *     cpu_active_mask  - has bit 'cpu' set iff cpu available to migration
 *

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-22 15:59:47 +08:00
Amit Daniel Kachhap 0236141837 thermal: add generic cpufreq cooling implementation
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00