Select IIO_BUFFER and IIO_TRIGGERED_BUFFER to compile maxim_thermocouple.
Signed-off-by: Alison Schofield <amsfield22@gmail.com>
Cc: Daniel Baluta <daniel.baluta@gmail.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Add initial driver support for MAX6675, and MAX31855 thermocouple chips.
Cc: Marek Vasut <marex@denx.de>
Cc: Matt Porter <mporter@konsulko.com>
Signed-off-by: Matt Ranostay <mranostay@gmail.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Support for TSYS02D temperature sensor
Signed-off-by: Ludovic Tancerel <ludovic.tancerel@maplehightech.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Support for TSYS01 temperature sensor
Signed-off-by: Ludovic Tancerel <ludovic.tancerel@maplehightech.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
the TI TMP006 is a non-contact temperature sensor with I2C interface;
it measures the surface temperature of a distance object using a
thermopile to absorb IR energy emitted from the object
the sensor has two channels: IR sensor voltage (16-bit) and reference
temperature of the chip (14-bit); datasheet is here:
http://www.ti.com/lit/ds/symlink/tmp006.pdf
v2 (thanks to Grygorii Strashko, Lars-Peter Clausen, Jonathan Cameron
for review comments):
* power down device on driver remove
* use sign_extend32()
* style cleanup
* add comments what channel raw LSBs mean
* spelling of thermopile
Signed-off-by: Peter Meerwald <pmeerw@pmeerw.net>
Cc: Grygorii Strashko <grygorii.strashko@ti.com>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Jonathan Cameron <jic23@kernel.org>
Cc: LM Sensors <lm-sensors@lm-sensors.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Alison Schofield
Matt Ranostay
Ludovic Tancerel
Peter Meerwald