Граф коммитов

48 Коммитов

Автор SHA1 Сообщение Дата
Eduardo Valentin 0dd88793aa thermal: hwmon: move hwmon support to single file
In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-03 09:09:12 -04:00
Zhang Rui 036e8a13b8 Merge branches 'exynos', 'imx' and 'fixes' of .git into next 2013-08-15 15:25:27 +08:00
Amit Daniel Kachhap c68213780e thermal: exynos: Moving exynos thermal files into samsung directory
This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:51:59 -04:00
Shawn Guo ca3de46b50 thermal: add imx thermal driver support
This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid).  Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs.  The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.

Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:45:34 -04:00
Zhang Rui 9d1968fdab Merge branch 'cpu-package-thermal' of .git into next 2013-06-18 07:26:49 +08:00
Randy Dunlap b3ba020652 thermal: fix x86_pkg_temp_thermal.c build and Kconfig
Fix build error in x86_pkg_temp_thermal.c.  It requires that
X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol,
since it depends on X86_MCE (indirectly).

Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block,
so remove that duplicated dependency.

ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!
ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!

Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Acked-by: Borislav Petkov <bp@suse.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-18 07:26:24 +08:00
Zhang Rui f157f5964b Merge branch 'cpu-package-thermal' of .git into next
Conflicts:
	drivers/thermal/Kconfig
	drivers/thermal/Makefile
2013-06-18 06:31:26 +08:00
Srinivas Pandruvada f1a18a1056 Thermal: CPU Package temperature thermal
This driver register CPU digital temperature sensor as a thermal
zone at package level.
Each package will show up as one zone with at max two trip points.
These trip points can be both read and updated. Once a non zero
value is set in the trip point, if the package package temperature
goes above or below this setting, a thermal notification is
generated.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-18 06:27:47 +08:00
Eduardo Valentin eb982001db thermal: introduce TI SoC thermal driver
This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28 10:40:37 +08:00
Eduardo Valentin f7188b3dde thermal: cpu_cooling: update Kconfig entry
There is no support for hotplug or any other means of reducing
temperature. So, this patch removes these references from Kconfig.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:40 +08:00
Zhang Rui bbf7fc88c7 Thermal: build cpu_cooling code into thermal_sys module
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:49 +08:00
Eduardo Valentin 8837295a73 thermal: add a warning for temperature emulation feature
Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:34:42 +08:00
Amit Daniel Kachhap bffd1f8ac8 thermal: exynos: Adapt to temperature emulation core thermal framework
This removes the driver specific sysfs support of the temperature
emulation and uses the newly added core thermal framework for thermal
emulation. An exynos platform specific handler is added to support this.

In this patch, the exynos senor(tmu) related code and exynos framework
related (thermal zone, cooling devices) code are intentionally kept separate.
So an emulated function pointer is passed from sensor to framework. This is
beneficial in adding more sensor support using the same framework code
which is an ongoing work. The goal is to finally split them totally. Even
the existing read_temperature also follows the same execution method.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:29:54 +08:00
Ezequiel Garcia fa0d654c84 thermal: Add driver for Armada 370/XP SoC thermal management
This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.

Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.

The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.

Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:04:09 +08:00
Zhang Rui 9d185d0417 Thermal: rename thermal governor Kconfig option to avoid generic naming
Currently, we have three Kconfig options for thermal governors, aka,
CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE.
But these names are too generic that may bring confusion to users.

Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE,
CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE
to avoid the generic naming.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Andrew Lunn 74ffa64c23 Thermal: Dove: Add Themal sensor support for Dove.
The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:26:02 +08:00
Nobuhiro Iwamatsu 7060aa3664 thermal: Add support for the thermal sensor on Kirkwood SoCs
This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.

Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:25:56 +08:00
Amit Daniel Kachhap e6e238c38b thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.

This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.

Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:42 +08:00
Jacob Pan d6d71ee4a1 PM: Introduce Intel PowerClamp Driver
Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.

Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.

Please refer to Documentation/thermal/intel_powerclamp.txt for more details.

Signed-off-by: Arjan van de Ven <arjan@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:00 +08:00
Jonghwa Lee bbf63be4f3 Thermal: exynos: Add sysfs node supporting exynos's emulation mode.
This patch supports exynos's emulation mode with newly created sysfs node.
Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
management unit. Thermal emulation mode supports software debug for TMU's
operation. User can set temperature manually with software code and TMU
will read current temperature from user value not from sensor's value.
This patch includes also documentary placed under Documentation/thermal/.

Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:22:37 +08:00
Linus Torvalds a2013a13e6 Merge branch 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial
Pull trivial branch from Jiri Kosina:
 "Usual stuff -- comment/printk typo fixes, documentation updates, dead
  code elimination."

* 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial: (39 commits)
  HOWTO: fix double words typo
  x86 mtrr: fix comment typo in mtrr_bp_init
  propagate name change to comments in kernel source
  doc: Update the name of profiling based on sysfs
  treewide: Fix typos in various drivers
  treewide: Fix typos in various Kconfig
  wireless: mwifiex: Fix typo in wireless/mwifiex driver
  messages: i2o: Fix typo in messages/i2o
  scripts/kernel-doc: check that non-void fcts describe their return value
  Kernel-doc: Convention: Use a "Return" section to describe return values
  radeon: Fix typo and copy/paste error in comments
  doc: Remove unnecessary declarations from Documentation/accounting/getdelays.c
  various: Fix spelling of "asynchronous" in comments.
  Fix misspellings of "whether" in comments.
  eisa: Fix spelling of "asynchronous".
  various: Fix spelling of "registered" in comments.
  doc: fix quite a few typos within Documentation
  target: iscsi: fix comment typos in target/iscsi drivers
  treewide: fix typo of "suport" in various comments and Kconfig
  treewide: fix typo of "suppport" in various comments
  ...
2012-12-13 12:00:02 -08:00
Masanari Iida e41e85cc17 treewide: Fix typos in various Kconfig
Correct spelling typo within various Kconfig.

Signed-off-by: Masanari Iida <standby24x7@gmail.com>
Signed-off-by: Jiri Kosina <jkosina@suse.cz>
2012-12-03 11:03:56 +01:00
Eduardo Valentin 4ba115b1e1 thermal: cpu cooling: allow module builds
As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
  generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y

with the following drive:
CONFIG_OMAP_BANDGAP=m

generates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!

This patch changes cpu cooling driver to allow it
to be built as module.

Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-22 15:59:52 +08:00
hongbo.zhang aa1acb0451 Thermal: Add ST-Ericsson DB8500 thermal driver.
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically.  The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:50:34 +08:00
Zhang Rui ec54c74c8f Exynos: Add missing dependency
CPU_FREQ_TABLE depends on CPU_FREQ. Selecting CPU_FREQ_TABLE without checking
for dependencies gives the following compilation warnings:
warning: (ARCH_TEGRA_2x_SOC && ARCH_TEGRA_3x_SOC && UX500_SOC_DB8500 &&
CPU_THERMAL && EXYNOS_THERMAL) selects CPU_FREQ_TABLE which has unmet
direct dependencies (ARCH_HAS_CPUFREQ && CPU_FREQ)

Based-on-patch-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:46 +08:00
Zhang Rui 72e1989782 Refactor drivers/thermal/Kconfig
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:30 +08:00
Durgadoss R a56757af8e Thermal: Provide option to choose default thermal governor
This patch provides option to choose the default thermal
governor. If no option is provided, the step_wise
governor is selected by default.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:09 +08:00
Durgadoss R 1cc807a234 Thermal: Add a thermal notifier for user space
This patch registers a governor which will let the
user land manage the platform thermals. Whenever a
trip happens, this governor just notifies the user
space using kobj_uevent().

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R e151a202a0 Thermal: Introduce a step_wise thermal governor
This patch adds a simple step_wise governor to the
generic thermal layer. This algorithm throttles the
cooling devices in a linear fashion. If the 'trend'
is heating, it throttles by one step. And if the
thermal trend is cooling it de-throttles by one step.

This actually moves the throttling logic from thermal_sys.c
and puts inside step_wise.c, without any change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
Durgadoss R 4ccc5743ae Thermal: Introduce fair_share thermal governor
This patch introduces a simple 'weight' based
governor named fair_share governor. Whenever the
thermal framework gets notified of the trip point
violation, this governor (if configured), throttles
the cooling devices associated with a thermal zone.

This mapping between a thermal zone and a cooling device
and the effectiveness of cooling are provided in the
platform layer.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
David Rientjes dd8e8c4a2c thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configured
Commit 0236141837 ("thermal: add generic cpufreq cooling
implementation") requires cpufreq_frequency_get_table(), but that
function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the
following build error:

  drivers/built-in.o: In function `cpufreq_get_max_state':
  drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table'
  drivers/built-in.o: In function `get_cpu_frequency':
  drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table'

Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration.

It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so
select it there as well.

Signed-off-by: David Rientjes <rientjes@google.com>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-15 14:00:07 -07:00
Amit Daniel Kachhap f22d9c03cc thermal: exynos5: add exynos5250 thermal sensor driver support
Insert exynos5 TMU sensor changes into the thermal driver.  Some exynos4
changes are made generic for exynos series.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap c48cbba6fe hwmon: exynos4: move thermal sensor driver to driver/thermal directory
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap 0236141837 thermal: add generic cpufreq cooling implementation
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Kuninori Morimoto 1e426ffddf thermal: add Renesas R-Car thermal sensor support
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:37 +08:00
Viresh Kumar b9c7aff481 drivers/thermal/spear_thermal.c: add Device Tree probing capability
SPEAr platforms now support DT and so must convert all drivers to support
DT.  This patch adds DT probing support for SPEAr thermal sensor driver
and updates its documentation too.

Also, as SPEAr is the only user of this driver and is only available with
DT, make this an only DT driver.  So, platform_data is completely removed
and passed via DT now.

Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Cc: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-06-02 01:49:38 -04:00
Vincenzo Frascino 6a92c36688 thermal: add support for thermal sensor present on SPEAr13xx machines
ST's SPEAr13xx machines are based on CortexA9 ARM processors.  These
machines contain a thermal sensor for junction temperature monitoring.

This patch adds support for this thermal sensor in existing thermal
framework.

[akpm@linux-foundation.org: little code cleanup]
[akpm@linux-foundation.org: print the pointer correctly]
[viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR]
Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:05:32 -04:00
Jean Delvare ab92402af0 thermal: hide CONFIG_THERMAL_HWMON
It's about time to revert 16d7523973 ("thermal: Create
CONFIG_THERMAL_HWMON=n").  Anybody running a kernel >= 2.6.40 would also
be running a recent enough version of lm-sensors.

Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of
dropping it, we keep it but hide it.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02 14:51:25 -04:00
Rafael J. Wysocki af06216a8e ACPI: Fix build for CONFIG_NET unset
Several ACPI drivers fail to build if CONFIG_NET is unset, because
they refer to things depending on CONFIG_THERMAL that in turn depends
on CONFIG_NET.  However, CONFIG_THERMAL doesn't really need to depend
on CONFIG_NET, because the only part of it requiring CONFIG_NET is
the netlink interface in thermal_sys.c.

Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET
and remove the dependency of CONFIG_THERMAL on CONFIG_NET from
drivers/thermal/Kconfig.

Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: Randy Dunlap <randy.dunlap@oracle.com>
Cc: Ingo Molnar <mingo@elte.hu>
Cc: Len Brown <lenb@kernel.org>
Cc: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Luming Yu <luming.yu@intel.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2011-02-28 18:00:31 -08:00
R.Durgadoss 4cb1872870 thermal: Add event notification to thermal framework
This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.

Signed-off-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-01-12 00:08:35 -05:00
Jan Beulich df43176c93 thermal: add missing Kconfig dependency
Otherwise THERMAL_HWMON can be selected when HWMON=n and THERMAL=n, which
fails to build.

Signed-off-by: Jan Beulich <jbeulich@novell.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-09-19 01:41:49 -04:00
Rene Herman 16d7523973 thermal: Create CONFIG_THERMAL_HWMON=n
A bug in libsensors <= 2.10.6 is exposed
when this new hwmon I/F is enabled.
Create CONFIG_THERMAL_HWMON=n
until some time after libsensors 2.10.7 ships
so those users can run the latest kernel.

libsensors 3.x is already fixed -- those users
can use CONFIG_THERMAL_HWMON=y now.

Signed-off-by: Rene Herman <rene.herman@gmail.com>
Acked-by: Mark M. Hoffman <mhoffman@lightlink.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25 19:25:42 -04:00
Zhang Rui 63c4ec905d thermal: add the support for building the generic thermal as a module
Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29 02:44:00 -04:00
Len Brown ece54e2ff4 thermal: delete "default y"
The generic thermal I/F gets selected by ACPI_THERMAL --
its only current customer.
it doesn't need to clutter other configs by default.

Signed-off-by: Len Brown <len.brown@intel.com>
2008-03-18 01:22:10 -04:00
Len Brown 91f57fa121 Revert "thermal: fix generic thermal I/F for hwmon"
This reverts commit 3152fb9f11.

This broke libsensors.

Acked-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-03-18 01:14:37 -04:00
Zhang, Rui 3152fb9f11 thermal: fix generic thermal I/F for hwmon
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-03-13 01:49:01 -04:00
Len Brown 543a956140 ACPI: thermal: syntax, spelling, kernel-doc
Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-07 23:48:04 -05:00
Zhang Rui 203d3d4aa4 the generic thermal sysfs driver
The Generic Thermal sysfs driver for thermal management.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-01 23:12:19 -05:00