Граф коммитов

38 Коммитов

Автор SHA1 Сообщение Дата
Geert Uytterhoeven 2771d00081 thermal: rcar: Fix typo in r8a73a4 SoC name
r8a73a4 is R-Mobile APE6, not AP6.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-04-07 12:53:34 -07:00
Linus Torvalds 3d883483dc Merge branch 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal
Pull more thermal managament updates from Zhang Rui:
 "Specifics:

   - Exynos thermal driver refactoring.  Several cleanups, code
     optimization, unused symbols removal, and unused feature removal in
     Exynos thermal driver.  Thanks Lukasz for this effort.

   - Exynos thermal driver support to OF thermal.  After the code
     refactoring, the driver earned the support to OF thermal.  Chip
     thermal data were moved from driver code to DTS, reducing the code
     footprint.  Thanks Lukasz for this.

   - After receiving the OF thermal support, the exynos thermal driver
     now must allow modular build.  Thanks Arnd for detecting, reporting
     and fixing this.

   - Exynos thermal driver support to Exynos 7 SoC.  Thanks Abhilash for
     this.

   - Accurate temperature reporting on Rockchip thermal driver, thanks
     to Caesar.

   - Fix on how OF thermal enables its zones, thanks Lukasz for fixing.

   - Fixes in OF thermal examples under Documentation/.  Thanks Srinivas
     for fixing"

* 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
  thermal: exynos: Add TMU support for Exynos7 SoC
  dts: Documentation: Add documentation for Exynos7 SoC thermal bindings
  cpufreq: exynos: allow modular build
  thermal: Fix examples in DT documentation
  thermal: exynos: Correct sanity check at exynos_report_trigger() function
  thermal: Kconfig: Remove config for not used EXYNOS_THERMAL_CORE
  thermal: exynos: Remove exynos_tmu_data.c file
  thermal: rockchip: make temperature reporting much more accurate
  thermal: exynos: Remove exynos_thermal_common.[c|h] files
  thermal: samsung: core: Exynos TMU rework to use device tree for configuration
  dts: Documentation: Update exynos-thermal.txt example for Exynos5440
  dts: Documentation: Extending documentation entry for exynos-thermal
  cpufreq: exynos: Use device tree to determine if cpufreq cooling should be registered
  thermal: exynos: Modify exynos thermal code to use device tree for cpu cooling configuration
  thermal: exynos: Provide thermal_exynos.h file to be included in device tree files
  thermal: exynos: cosmetic: Correct comment format
  thermal: of: Enable thermal_zoneX when sensor is correctly added
2015-02-19 17:51:22 -08:00
Paul Walmsley 193c9d23a0 Documentation: DT bindings: add more Tegra chip compatible strings
Align compatible strings for several IP blocks present on Tegra chips
with the latest doctrine from the DT maintainers:

http://marc.info/?l=devicetree&m=142255654213019&w=2

The primary objective here is to avoid checkpatch warnings, per:

http://marc.info/?l=linux-tegra&m=142201349727836&w=2

DT binding text files have been updated for the following IP blocks:

- PCIe
- SOR
- SoC timers
- AHB "gizmo"
- APB_MISC
- pinmux control
- UART
- PWM
- I2C
- SPI
- RTC
- PMC
- eFuse
- AHCI
- HDA
- XUSB_PADCTRL
- SDHCI
- SOC_THERM
- AHUB
- I2S
- EHCI
- USB PHY

N.B. The nvidia,tegra20-timer compatible string is removed from the
nvidia,tegra30-timer.txt documentation file because it's already
mentioned in the nvidia,tegra20-timer.txt documentation file.

This second version takes into account the following requests from
Rob Herring <robherring2@gmail.com>:

- Per-IP block patches have been combined into a single patch

- Explicit documentation about which compatible strings are actually
  matched by the driver has been removed.  In its place is implicit
  documentation that loosely follows Rob's prescribed format:

  "Must contain '"nvidia,<chip>-pcie", "nvidia,tegra20-pcie"' where
   <chip> is tegra30, tegra132, ..." [...]  "You should attempt to
   document known values of <chip> if you use it"

Signed-off-by: Paul Walmsley <paul@pwsan.com>
Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: Dylan Reid <dgreid@chromium.org>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Hans de Goede <hdegoede@redhat.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Jingchang Lu <jingchang.lu@freescale.com>
Cc: John Crispin <blogic@openwrt.org>
Cc: Kumar Gala <galak@codeaurora.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Mikko Perttunen <mperttunen@nvidia.com>
Cc: Murali Karicheri <m-karicheri2@ti.com>
Cc: Paul Walmsley <pwalmsley@nvidia.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Peter De Schrijver <pdeschrijver@nvidia.com>
Cc: Peter Hurley <peter@hurleysoftware.com>
Cc: Sean Paul <seanpaul@chromium.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Takashi Iwai <tiwai@suse.de>
Cc: Tejun Heo <tj@kernel.org>
Cc: "Terje Bergström" <tbergstrom@nvidia.com>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Tuomas Tynkkynen <ttynkkynen@nvidia.com>
Cc: Wolfram Sang <wsa@the-dreams.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: dri-devel@lists.freedesktop.org
Cc: linux-i2c@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pci@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-pwm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Rob Herring <robh@kernel.org>
2015-02-03 20:37:31 -06:00
Abhilash Kesavan 14ccc17a37 dts: Documentation: Add documentation for Exynos7 SoC thermal bindings
Add documentation for exynos7 thermal bindings including compatible
name and special clock properties.

Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-01-31 15:17:48 -04:00
Srinivas Kandagatla 252454f5cb thermal: Fix examples in DT documentation
There are various issues with the examples in this documentation, some
of the DT labels are invalid and one of the macro THERMAL_NO_LIMITS
referenced is not available as well.

This patch attempts to fix such errors in the documentation.

Signed-off-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-01-28 13:29:58 -04:00
Lukasz Majewski d29f0a1095 dts: Documentation: Update exynos-thermal.txt example for Exynos5440
Updating exynos-thermal.txt documentation entry for Exynos5440

Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-01-24 17:38:12 -04:00
Lukasz Majewski 7e20525809 dts: Documentation: Extending documentation entry for exynos-thermal
Properties necessary for providing Exynos thermal configuration via device
tree.

Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-01-24 17:34:36 -04:00
Ezequiel Garcia e920f9b632 thermal: armada: Remove support for A375-Z1 SoC
The Armada 375 Z1 SoC revision is no longer supported. This commit
removes the quirk needed for the thermal sensor.

Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 16:55:42 -04:00
Caesar Wang 6962ad52a5 dt-bindings: document Rockchip thermal
This add the necessary binding documentation for the thermal
found on Rockchip SoCs

Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 14:25:18 -04:00
Mikko Perttunen 0199e9938f of: Add bindings for nvidia,tegra124-soctherm
This adds binding documentation and headers for the Tegra124
SOCTHERM device tree node.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Stephen Warren <swarren@nvidia.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:17 -04:00
Geert Uytterhoeven 689bd24c5e thermal: rcar: Add binding docs for new R-Car Gen2 SoCs
- r8a7792 (R-Car V2H)
  - r8a7793 (R-Car M2-N)
  - r8a7794 (R-Car E2)

r8a7791 is now called "R-Car M2-W".

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-02 23:02:49 -04:00
Anson Huang 3c94f17e72 Thermal: imx: add i.mx6sx thermal support
i.MX6SX has some new features of thermal interrupt function,
there are LOW, HIGH and PANIC irq for thermal sensor, so add
platform data to separate different thermal version;

The reset value of LOW ALARM is 0 which means the highest
temp, so the LOW ALARM will be triggered once irq is enabled,
so we need to correct it before enabling thermal irq;

Enable PANIC ALARM as critical trip point, it will trigger
system reset via SRC module once PANIC IRQ is triggered, it
is pure hardware function, so use it instead of software
reset by cooling device.

Signed-off-by: Anson Huang <b20788@freescale.com>
Tested-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-08-09 10:29:30 -04:00
Zhang Rui 47d104ba58 Merge branches 'exynos-fix', 'for-rc', 'int3403-fix', 'misc', 'rcar-thermal' and 'sti-thermal' of .git into next 2014-07-22 10:13:00 +08:00
Geert Uytterhoeven fa313103c9 thermal: rcar: Document SoC-specific bindings
The documentation only mentioned the generic fallback compatible property.
Add the missing SoC-specific compatible properties, some of which are
already in use.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-15 23:00:03 +08:00
Chanwoo Choi 1fe56dc16a thermal: samsung: Add TMU support for Exynos3250 SoC
This patch add registers, bit fields and compatible strings for Exynos3250 TMU
(Thermal Management Unit). Exynos3250 uses the Cortex-A7 dual cores and has
a target speed of 1.0 GHz.

Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
[Add MUX address setting bits by Jonghwa Lee]
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Reviewed-by: Amit Daniel Kachhap<amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-15 22:58:44 +08:00
Lee Jones a563591243 thermal: sti: Supply Device Tree documentation
Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Acked-by: Peter Griffin <peter.griffin@linaro.org>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-15 22:00:30 +08:00
Zhang Rui 63745aa72e Merge branches 'armada-375-380-soc-support', 'eduardo-thermal-soc-fixes', 'intel-soc-dts-thermal' and 'thermal-soc-fixes' of .git into next 2014-05-15 17:18:02 +08:00
Ezequiel Garcia e6e0a68c6c thermal: armada: Support Armada 380 SoC
Now that a generic infrastructure is in place, it's possible to support
the Armada 380 SoC thermal sensor. This sensor is similar to the one
available in the already supported SoCs, with its specific temperature formula
and specific sensor initialization.

Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-05-15 17:12:49 +08:00
Ezequiel Garcia e2d5f05b74 thermal: armada: Support Armada 375 SoC
Now that a generic infrastructure is in place, it's possible to support
the new Armada 375 SoC thermal sensor. This sensor is similar to the one
available in the already supported SoCs, with its specific temperature formula
and specific sensor initialization.

In addition, we also add support for the Z1 SoC stepping, which needs
an initialization-quirk to work properly.

Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-05-15 17:12:49 +08:00
Naveen Krishna Chatradhi 923488a53e thermal: samsung: Add TMU support for Exynos5260 SoCs
This patch adds the registers, bit fields and compatible strings
required to support for the 5 TMU channels on Exynos5260.

Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-05-06 14:55:42 -04:00
Naveen Krishna Chatradhi 14a11dc7e0 thermal: samsung: Add TMU support for Exynos5420 SoCs
Exynos5420 has 5 TMU channels, the TRIMINFO register is
misplaced for TMU channels 2, 3 and 4
TRIMINFO at 0x1006c000 contains data for TMU channel 3
TRIMINFO at 0x100a0000 contains data for TMU channel 4
TRIMINFO at 0x10068000 contains data for TMU channel 2

This patch
1 Adds the neccessary register changes and arch information
   to support Exynos5420 SoCs.
2. Handles the gate clock for misplaced TRIMINFO register
3. Updates the Documentation at
   Documentation/devicetree/bindings/thermal/exynos-thermal.txt

Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Andrew Bresticker <abrestic@chromium.org>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-05-06 14:51:32 -04:00
Naveen Krishna Chatradhi 9025d563cd thermal: samsung: change base_common to more meaningful base_second
On Exynos5440 and Exynos5420 there are registers common
across the TMU channels.

To support that, we introduced a ADDRESS_MULTIPLE flag in the
driver and the 2nd set of register base and size are provided
in the "reg" property of the node.

As per Amit's suggestion, this patch changes the base_common
to base_second and SHARED_MEMORY to ADDRESS_MULTIPLE.

Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-05-06 14:51:32 -04:00
Zhang Rui 8c59ecb5c1 Merge branches 'misc' and 'soc' of .git into next 2014-01-03 22:55:04 +08:00
Anson Huang 329fe7b14d thermal: imx: add necessary clk operation
Thermal sensor needs pll3_usb_otg when measuring temperature,
otherwise the temperature read will be incorrect, so need to
enable this clk before sensor working, for alarm function,
as hardware will take measurement periodically, so we should
keep this clk always on once alarm function is enabled.

Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-03 22:49:16 +08:00
Eduardo Valentin 4e5e4705bf thermal: introduce device tree parser
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:31:34 -04:00
Zhang Rui 036e8a13b8 Merge branches 'exynos', 'imx' and 'fixes' of .git into next 2013-08-15 15:25:27 +08:00
Amit Daniel Kachhap 0e97194bcf ARM: dts: thermal: exynos: Add documentation for Exynos SoC thermal bindings
Proper description for Exynos4 bindings added to Documentation/devicetree/
bindings. It adds description to use multiple TMU instances, optional voltage
supply node and optional shared register across multiple TMU's.

Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:52:04 -04:00
Shawn Guo ca3de46b50 thermal: add imx thermal driver support
This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid).  Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs.  The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.

Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:45:34 -04:00
Eduardo Valentin 57d1617137 thermal: ti-soc-thermal: use standard GPIO DT bindings
This change updates the ti-soc-thermal driver to use
standard GPIO DT bindings to read the GPIO number associated
to thermal shutdown IRQ, in case the device features it.

Previously, the code was using a specific DT bindings.
As now OMAP supports the standard way to model GPIOs,
there is no point in having a ti specific binding.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-08 10:11:59 -04:00
Eduardo Valentin ca0c711463 thermal: ti-soc-thermal: add DT example for DRA752 chip
Update documentation by adding an example for DRA752 on DT description.

Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:16:15 +08:00
Eduardo Valentin 0c1569590a thermal: ti-soc-thermal: update DT reference for OMAP5430
Add missing irq line for TALERT on DT entry for OMAP5430.

Cc: linux-pm@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:12:13 +08:00
Eduardo Valentin eb982001db thermal: introduce TI SoC thermal driver
This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28 10:40:37 +08:00
Ezequiel Garcia fa0d654c84 thermal: Add driver for Armada 370/XP SoC thermal management
This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.

Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.

The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.

Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:04:09 +08:00
Andrew Lunn 74ffa64c23 Thermal: Dove: Add Themal sensor support for Dove.
The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:26:02 +08:00
Nobuhiro Iwamatsu 7060aa3664 thermal: Add support for the thermal sensor on Kirkwood SoCs
This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.

Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:25:56 +08:00
Kuninori Morimoto 76cc188749 thermal: rcar: add Device Tree support
Support for loading the Renesas R-Car thermal module via devicetree.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:25:36 +08:00
hongbo.zhang aa1acb0451 Thermal: Add ST-Ericsson DB8500 thermal driver.
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically.  The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:50:34 +08:00
Viresh Kumar b9c7aff481 drivers/thermal/spear_thermal.c: add Device Tree probing capability
SPEAr platforms now support DT and so must convert all drivers to support
DT.  This patch adds DT probing support for SPEAr thermal sensor driver
and updates its documentation too.

Also, as SPEAr is the only user of this driver and is only available with
DT, make this an only DT driver.  So, platform_data is completely removed
and passed via DT now.

Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Cc: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-06-02 01:49:38 -04:00