57d1617137
This change updates the ti-soc-thermal driver to use standard GPIO DT bindings to read the GPIO number associated to thermal shutdown IRQ, in case the device features it. Previously, the code was using a specific DT bindings. As now OMAP supports the standard way to model GPIOs, there is no point in having a ti specific binding. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> |
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| .. | ||
| Kconfig | ||
| Makefile | ||
| TODO | ||
| dra752-bandgap.h | ||
| dra752-thermal-data.c | ||
| omap4-thermal-data.c | ||
| omap4xxx-bandgap.h | ||
| omap5-thermal-data.c | ||
| omap5xxx-bandgap.h | ||
| ti-bandgap.c | ||
| ti-bandgap.h | ||
| ti-thermal-common.c | ||
| ti-thermal.h | ||