WSL2-Linux-Kernel/arch/arm/plat-samsung
Linus Torvalds 8f40842e42 MTD updates for v4.6
NAND:
  * Add sunxi_nand randomizer support
  * begin refactoring NAND ecclayout structs
  * fix pxa3xx_nand dmaengine usage
  * brcmnand: fix support for v7.1 controller
  * add Qualcomm NAND controller driver
 
 SPI NOR:
  * add new ls1021a, ls2080a support to Freescale QuadSPI
  * add new flash ID entries
  * support bottom-block protection for Winbond flash
  * support Status Register Write Protect
  * remove broken QPI support for Micron SPI flash
 
 JFFS2:
  * improve post-mount CRC scan efficiency
 
 General:
  * refactor bcm63xxpart parser, to later extend for NAND
  * add writebuf size parameter to mtdram
 
 Other minor code quality improvements
 -----BEGIN PGP SIGNATURE-----
 Version: GnuPG v1
 
 iQIcBAABAgAGBQJW9CzVAAoJEFySrpd9RFgtQFwQAJdH0wnsZTYfeqToIaD8yMM4
 rtakV/oIMSvMSWuqK+Mx0k6OjGwswgnGZ+tfQLRAYIhb33P8UD0F8Dv5D0x/+zRo
 EgiDlnss/lliXpbh2u4fsANSpFF/JUPXFqU6NanjqQ1rtvR60LUeKOFEz1NRciuV
 Ib6oDLFeXQFxwG0J+EBDo5MrT8aiPODtx4TS8VVo0o0y/WLkEujQPP5592TnCPha
 zX0n9azi26pARo7VLqWjVD8GigY5PadqJAWOZcQr0dGMQv5URtWcCCdThiNsCEzY
 SW9cYSr4CBdy1FIeoJ47yoBg8aFzhyeeuF1efb1U0MoYVL0rdIbznop3Kwilj48L
 Rnh4hvKkrTH16rO6RfKm1lIJaJQYKMErXyEceYMIjV91fEL3qhfbU9W6+Q5HT4hY
 oJmlH+4e/I1Jtf+vW4xFGMYclmYwCO6GJ4HHqnNpby/iH/nZ07hNX3lbxrlqHMwh
 MrSIidqLTsseXcyHBFc+42AsWs8unaYWVB0N3VFkEgl0BFyPObAtvwnHA6zywMvp
 EqJijXFG8VPcztE3eTIMbd0WOkxTjpMT6YHzpZqli/ENxCgu79OWELYrJ0/vC5Uj
 HK0qxgvIzUyJgmikkySDvd/Hc6HWItYonlcAht0VErNfTTfkMwWgRz1W4ZRB6bOJ
 7M83aytLyRYaPGEbwaoR
 =xOlP
 -----END PGP SIGNATURE-----

Merge tag 'for-linus-20160324' of git://git.infradead.org/linux-mtd

Pull MTD updates from Brian Norris:
 "NAND:
   - Add sunxi_nand randomizer support
   - begin refactoring NAND ecclayout structs
   - fix pxa3xx_nand dmaengine usage
   - brcmnand: fix support for v7.1 controller
   - add Qualcomm NAND controller driver

  SPI NOR:
   - add new ls1021a, ls2080a support to Freescale QuadSPI
   - add new flash ID entries
   - support bottom-block protection for Winbond flash
   - support Status Register Write Protect
   - remove broken QPI support for Micron SPI flash

  JFFS2:
   - improve post-mount CRC scan efficiency

  General:
   - refactor bcm63xxpart parser, to later extend for NAND
   - add writebuf size parameter to mtdram

  Other minor code quality improvements"

* tag 'for-linus-20160324' of git://git.infradead.org/linux-mtd: (72 commits)
  mtd: nand: remove kerneldoc for removed function parameter
  mtd: nand: Qualcomm NAND controller driver
  dt/bindings: qcom_nandc: Add DT bindings
  mtd: nand: don't select chip in nand_chip's block_bad op
  mtd: spi-nor: support lock/unlock for a few Winbond chips
  mtd: spi-nor: add TB (Top/Bottom) protect support
  mtd: spi-nor: add SPI_NOR_HAS_LOCK flag
  mtd: spi-nor: use BIT() for flash_info flags
  mtd: spi-nor: disallow further writes to SR if WP# is low
  mtd: spi-nor: make lock/unlock bounds checks more obvious and robust
  mtd: spi-nor: silently drop lock/unlock for already locked/unlocked region
  mtd: spi-nor: wait for SR_WIP to clear on initial unlock
  mtd: nand: simplify nand_bch_init() usage
  mtd: mtdswap: remove useless if (!mtd->ecclayout) test
  mtd: create an mtd_oobavail() helper and make use of it
  mtd: kill the ecclayout->oobavail field
  mtd: nand: check status before reporting timeout
  mtd: bcm63xxpart: give width specifier an 'int', not 'size_t'
  mtd: mtdram: Add parameter for setting writebuf size
  mtd: nand: pxa3xx_nand: kill unused field 'drcmr_cmd'
  ...
2016-03-24 19:57:15 -07:00
..
include/plat ARM: SAMSUNG: Remove unused register offset definition 2016-02-25 13:24:27 +09:00
Kconfig ARM: s3c64xx: multiplatform support 2015-12-01 21:50:26 +01:00
Makefile ARM: s3c64xx: multiplatform support 2015-12-01 21:50:26 +01:00
adc.c ARM: plat-samsung: use to_platform_device() 2016-02-25 10:09:36 +09:00
cpu.c ARM: SAMSUNG: print CPU id on probe 2014-12-23 00:19:52 +09:00
dev-uart.c ARM: SAMSUNG: Include devs.h in dev-uart.c to prototype devices 2011-03-04 15:46:26 +09:00
devs.c mtd: nand: s3c2410: kill the ->ecc_layout field 2016-01-26 10:27:35 -08:00
gpio-samsung.c ARM: SoC multiplatform code changes for v4.5 2016-01-20 18:03:56 -08:00
init.c ARM: s3c64xx: prepare initcalls for multiplatform 2015-12-01 21:50:24 +01:00
platformdata.c ARM: SAMSUNG: remove all uses of clk_type member in sdhci platform data 2012-04-21 08:24:56 -07:00
pm-check.c arm/samsung: Change s3c_pm_run_res() to use System RAM type 2016-01-30 09:49:58 +01:00
pm-common.c ARM: SAMSUNG: Move common save/restore helpers to separate file 2014-03-21 04:09:25 +09:00
pm-debug.c ARM: S3C24XX: fix header file inclusions 2015-02-27 05:50:23 +09:00
pm-gpio.c Merge branch 'cleanup/gpio-header-removal' into next/soc 2014-07-26 18:00:40 +02:00
pm.c ARM: s3c64xx: allow building without board support 2015-12-01 21:50:26 +01:00
wakeup-mask.c driver-core: remove sysdev.h usage. 2011-12-21 16:26:03 -08:00
watchdog-reset.c ARM: SAMSUNG: Add watchdog reset driver 2013-06-19 03:13:16 +09:00