WSL2-Linux-Kernel/drivers/thermal/Kconfig

205 строки
6.1 KiB
Plaintext
Исходник Обычный вид История

#
# Generic thermal sysfs drivers configuration
#
menuconfig THERMAL
tristate "Generic Thermal sysfs driver"
help
Generic Thermal Sysfs driver offers a generic mechanism for
thermal management. Usually it's made up of one or more thermal
zone and cooling device.
Each thermal zone contains its own temperature, trip points,
cooling devices.
All platforms with ACPI thermal support can use this driver.
If you want this support, you should say Y or M here.
if THERMAL
config THERMAL_HWMON
bool
prompt "Expose thermal sensors as hwmon device"
depends on HWMON=y || HWMON=THERMAL
default y
help
In case a sensor is registered with the thermal
framework, this option will also register it
as a hwmon. The sensor will then have the common
hwmon sysfs interface.
Say 'Y' here if you want all thermal sensors to
have hwmon sysfs interface too.
choice
prompt "Default Thermal governor"
default THERMAL_DEFAULT_GOV_STEP_WISE
help
This option sets which thermal governor shall be loaded at
startup. If in doubt, select 'step_wise'.
config THERMAL_DEFAULT_GOV_STEP_WISE
bool "step_wise"
select THERMAL_GOV_STEP_WISE
help
Use the step_wise governor as default. This throttles the
devices one step at a time.
config THERMAL_DEFAULT_GOV_FAIR_SHARE
bool "fair_share"
select THERMAL_GOV_FAIR_SHARE
help
Use the fair_share governor as default. This throttles the
devices based on their 'contribution' to a zone. The
contribution should be provided through platform data.
config THERMAL_DEFAULT_GOV_USER_SPACE
bool "user_space"
select THERMAL_GOV_USER_SPACE
help
Select this if you want to let the user space manage the
lpatform thermals.
endchoice
config THERMAL_GOV_FAIR_SHARE
bool "Fair-share thermal governor"
help
Enable this to manage platform thermals using fair-share governor.
config THERMAL_GOV_STEP_WISE
bool "Step_wise thermal governor"
help
Enable this to manage platform thermals using a simple linear
config THERMAL_GOV_USER_SPACE
bool "User_space thermal governor"
help
Enable this to let the user space manage the platform thermals.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
config CPU_THERMAL
bool "generic cpu cooling support"
depends on CPU_FREQ
select CPU_FREQ_TABLE
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
help
This implements the generic cpu cooling mechanism through frequency
reduction. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c).
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
This will be useful for platforms using the generic thermal interface
and not the ACPI interface.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 15:41:40 +04:00
If you want this support, you should say Y here.
config THERMAL_EMULATION
bool "Thermal emulation mode support"
help
Enable this option to make a emul_temp sysfs node in thermal zone
directory to support temperature emulation. With emulation sysfs node,
user can manually input temperature and test the different trip
threshold behaviour for simulation purpose.
WARNING: Be careful while enabling this option on production systems,
because userland can easily disable the thermal policy by simply
flooding this sysfs node with low temperature values.
config IMX_THERMAL
tristate "Temperature sensor driver for Freescale i.MX SoCs"
depends on CPU_THERMAL
depends on MFD_SYSCON
depends on OF
help
Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
It supports one critical trip point and one passive trip point. The
cpufreq is used as the cooling device to throttle CPUs when the
passive trip is crossed.
config SPEAR_THERMAL
bool "SPEAr thermal sensor driver"
depends on PLAT_SPEAR
depends on OF
help
Enable this to plug the SPEAr thermal sensor driver into the Linux
thermal framework
config RCAR_THERMAL
tristate "Renesas R-Car thermal driver"
depends on ARCH_SHMOBILE
help
Enable this to plug the R-Car thermal sensor driver into the Linux
thermal framework
config KIRKWOOD_THERMAL
tristate "Temperature sensor on Marvell Kirkwood SoCs"
depends on ARCH_KIRKWOOD
depends on OF
help
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
config DOVE_THERMAL
tristate "Temperature sensor on Marvell Dove SoCs"
depends on ARCH_DOVE
depends on OF
help
Support for the Dove thermal sensor driver in the Linux thermal
framework.
config DB8500_THERMAL
bool "DB8500 thermal management"
depends on ARCH_U8500
default y
help
Adds DB8500 thermal management implementation according to the thermal
management framework. A thermal zone with several trip points will be
created. Cooling devices can be bound to the trip points to cool this
thermal zone if trip points reached.
config ARMADA_THERMAL
tristate "Armada 370/XP thermal management"
depends on ARCH_MVEBU
depends on OF
help
Enable this option if you want to have support for thermal management
controller present in Armada 370 and Armada XP SoC.
config DB8500_CPUFREQ_COOLING
tristate "DB8500 cpufreq cooling"
depends on ARCH_U8500
depends on CPU_THERMAL
default y
help
Adds DB8500 cpufreq cooling devices, and these cooling devices can be
bound to thermal zone trip points. When a trip point reached, the
bound cpufreq cooling device turns active to set CPU frequency low to
cool down the CPU.
config INTEL_POWERCLAMP
tristate "Intel PowerClamp idle injection driver"
depends on THERMAL
depends on X86
depends on CPU_SUP_INTEL
help
Enable this to enable Intel PowerClamp idle injection driver. This
enforce idle time which results in more package C-state residency. The
user interface is exposed via generic thermal framework.
config X86_PKG_TEMP_THERMAL
tristate "X86 package temperature thermal driver"
depends on X86_THERMAL_VECTOR
select THERMAL_GOV_USER_SPACE
default m
help
Enable this to register CPU digital sensor for package temperature as
thermal zone. Each package will have its own thermal zone. There are
two trip points which can be set by user to get notifications via thermal
notification methods.
menu "Texas Instruments thermal drivers"
source "drivers/thermal/ti-soc-thermal/Kconfig"
endmenu
menu "Samsung thermal drivers"
depends on PLAT_SAMSUNG
source "drivers/thermal/samsung/Kconfig"
endmenu
endif